- Series:
-
- Features:
-
- For Use With/Related Products:
-
- Electus conditionibus;
Odonata Lepidoptera products 27
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Features | For Use With/Related Products | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Features | For Use With/Related Products | ||
LOCTITE |
112
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SI 5140 METHOXY 85 GR TB/BN
|
LOCTITE 5140 | Potting Compound,1 Part | Non-Corrosive | Potting | ||||
LOCTITE |
247
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SI 5140 METHOXY 300ML CQ/BN
|
LOCTITE 5140 | Potting Compound,1 Part | Non-Corrosive | Potting | ||||
LOCTITE |
257
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SI 5145 RTV SILICONE 300ML CQ/BN
|
LOCTITE 5145 | Silicone | Non-Corrosive | Sealing Electronic Components | ||||
LOCTITE |
250
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
LOCTITE NC RTV SIL CL 80ML
|
- | - | - | - | ||||
LOCTITE |
17
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
LOCTITE NC RTV SIL CL 300ML
|
LOCTITE Superflex | Silicone | Clear,300mL | Multi-Purpose | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
3536 REWORKABLE UNDERFILL
|
LOCTITE 3536 | Epoxy | Heat Cure | Underfill Electronic Components | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SI5084 NUVA-SIL 300ML CQ/BN
|
LOCTITE 5084 | Silicone | Non-Corrosive | Sealing Electronic Components | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
3593 NON REWORKABLE UNDERFILL
|
LOCTITE 3593 | Epoxy | Heat Cure | Underfill Electronic Components | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
3508 CORNERBOND 30 ML
|
LOCTITE 3508 | Epoxy | Heat Cure | Underfill Electronic Components | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
384 ADHESIVE OUTPUT SY25ML
|
- | - | - | - | ||||
LOCTITE |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
315 SELF SHIM THERM ADH SY25ML
|
- | - | - | - | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
3621 DISPENS CHIPBOND 20ML PAN
|
- | - | - | - | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
3621 DISPENS CHIPBOND 30ML IWASH
|
- | - | - | - | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
3621 DISPENS CHIPBOND 30ML FUJI
|
- | - | - | - | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
384 ADHESIVE OUTPUT CR300ML
|
- | - | - | - | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
315 SELF SHIM THERM ADH CR300ML
|
- | - | - | - | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CHIPBONDER 3616 300CC CQ
|
LOCTITE 3616 | Epoxy | Heat Cure | SMD Components to PCB | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
LOCTITE ECCOBOND EO1062 10CC
|
- | Epoxy | Heat Cure | Multi-Purpose | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
LOCTITE 3609 10CC EFD US
|
- | - | - | - | ||||
LOCTITE |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
LOCTITE 3609 20CC PAN SY US
|
- | - | - | - |