- Series：
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- Type：
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- Contact Material：
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- Electus conditionibus;
Odonata Lepidoptera products 12
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Contact Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Contact Material | |
|
Pomona Electronics |
111
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TEST CLIP 16PIN SOIC
|
SOIC Clip | SOIC，0.15 to 0.35" Wide | - | |||
|
|
|
3M |
59
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
16 PIN TEST CLIP .3 ROW SPACE
|
923 | DIP，.300" | Copper Alloy | ||
|
|
|
3M |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
16-PIN TEST CLIP ALLOY DIP .30"
|
923 | DIP，.300" | Copper Alloy | ||
|
|
|
3M |
24
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
16-PIN TEST CLIP GOLD SOIC .15"
|
923 | SOIC，0.15" to 0.30" Wide | Copper Alloy | ||
|
|
|
3M |
45
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
16-PIN TEST CLIP GOLD DIP .30"
|
923 | DIP，.300" | Copper Alloy | ||
|
|
|
3M |
32
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
16-PIN TEST CLIP GOLD SOIC .30"
|
923 | SOIC，0.30" Body | Copper Alloy | ||
|
|
|
3M |
24
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
16-PIN TEST CLIP GOLD DIP .30"
|
923 | DIP，.300" | Copper Alloy | ||
|
|
3M |
3
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TEST CLIP 16POS DIP KNIFE EDGE.3
|
927 | DIP，0.3" Row Spacing | Copper Alloy | |||
|
|
|
3M |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 PIN TEST CLIP .5/.6 ROW SPACE
|
923 | DIP，.300" | Copper Alloy | ||
|
|
|
3M |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
16-PIN TEST CLIP ALLOY DIP .60"
|
923 | DIP，.600" | Copper Alloy | ||
|
|
|
Pomona Electronics |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
DIP TEST CLIP 16PIN CLOSED GOLD
|
DIP Clip | DIP，Standard | Beryllium Copper | ||
|
|
|
Pomona Electronics |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
DIP TEST CLIP 16PIN OPEN GOLD
|
DIP Clip | DIP，Open Back | Beryllium Copper |
