- Series:
-
- Type:
-
- Contact Material:
-
- Electus conditionibus;
Odonata Lepidoptera products 10
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Contact Finish | Contact Material | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Contact Finish | Contact Material | ||
Pomona Electronics |
1,931
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TEST CLIP 8PIN SOIC
|
SOIC Clip | SOIC,0.15 to 0.35" Wide | Gold | - | ||||
3M |
184
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
8-PIN TEST CLIP GOLD SOIC .15"
|
923 | SOIC,0.15" Body | Gold | Copper Alloy | ||||
3M |
113
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
8 PIN TEST CLIP .3 ROW SPACE
|
923 | DIP,.300" | Gold | Copper Alloy | ||||
3M |
72
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
8-PIN TEST CLIP ALLOY DIP .30"
|
923 | DIP,.300" | Gold | Copper Alloy | ||||
3M |
53
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
8-PIN TEST CLIP ALLOY SOIC .15"
|
923 | SOIC,0.15" Body | - | Copper Alloy | ||||
3M |
43
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
8-PIN TEST CLIP GOLD DIP .30"
|
923 | DIP,.300" | Gold | Copper Alloy | ||||
3M |
11
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
8-PIN TEST CLIP GOLD DIP .30"
|
923 | DIP,.300" | Gold | Copper Alloy | ||||
3M |
26
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TEST CLIP 8POS DIP KNIFE EDGE .3
|
927 | DIP,0.3" Row Spacing | Gold | Copper Alloy | ||||
Pomona Electronics |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
DIP TEST CLIP 8PIN CLOSED GOLD
|
DIP Clip | DIP,Standard | Gold | Beryllium Copper | ||||
Pomona Electronics |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
DIP TEST CLIP 8PIN OPEN GOLD
|
DIP Clip | DIP,Open Back | Gold | Beryllium Copper |