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573400D00010G
- Description :
- HEATSINK D-PAK3 TIN PLATED SMD
- Hæc est pars Manufacturer
- Datasheet (1)
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- Attachment Method :
- SMD Pad
- Diameter :
- -
- Height Off Base (Height of Fin) :
- 0.401" (10.20mm)
- Length :
- 0.500" (12.70mm)
- Material :
- Copper
- Material Finish :
- Tin
- Package Cooled :
- D3Pak
- Power Dissipation @ Temperature Rise :
- 1.0W @ 20°C
- Series :
- -
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 4.00°C/W @ 600 LFM
- Thermal Resistance @ Natural :
- 14.00°C/W
- Type :
- Top Mount
- Width :
- 1.220" (30.99mm)
