7106DG
- Description :
- BOARD LEVEL HEATSINK .375" D2PAK
- Hæc est pars Manufacturer
- Datasheet (1)
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- Attachment Method :
- SMD Pad
- Diameter :
- -
- Height Off Base (Height of Fin) :
- 0.375" (9.52mm)
- Length :
- 0.590" (14.99mm)
- Material :
- Copper
- Material Finish :
- Tin
- Package Cooled :
- TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10
- Power Dissipation @ Temperature Rise :
- 2.0W @ 40°C
- Series :
- -
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 5.00°C/W @ 400 LFM
- Thermal Resistance @ Natural :
- -
- Type :
- Top Mount
- Width :
- 1.020" (25.91mm)