7106DG

Description :
BOARD LEVEL HEATSINK .375" D2PAK
Attachment Method :
SMD Pad
Diameter :
-
Height Off Base (Height of Fin) :
0.375" (9.52mm)
Length :
0.590" (14.99mm)
Material :
Copper
Material Finish :
Tin
Package Cooled :
TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10
Power Dissipation @ Temperature Rise :
2.0W @ 40°C
Series :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
5.00°C/W @ 400 LFM
Thermal Resistance @ Natural :
-
Type :
Top Mount
Width :
1.020" (25.91mm)

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