Apex Microtechnology

HS24

Description :
HEATSINK SMT
Attachment Method :
SMD Pad
Diameter :
-
Height Off Base (Height of Fin) :
0.400" (10.16mm)
Length :
0.500" (12.70mm)
Material :
Copper
Material Finish :
Solderable
Package Cooled :
SMD
Power Dissipation @ Temperature Rise :
-
Series :
Apex Precision Power
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
16.00°C/W @ 600 LFM
Thermal Resistance @ Natural :
50.00°C/W
Type :
Top Mount
Width :
1.220" (30.99mm)

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