18-6513-11
- Description :
- CONN IC DIP SOCKET 18POS GOLD
- Hæc est pars Manufacturer
- Datasheet (1)
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- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 10μin (0.25μm)
- Contact Finish Thickness - Post :
- 10μin (0.25μm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Closed Frame
- Housing Material :
- Polyamide (PA46)，Nylon 4/6，Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 18 (2 x 9)
- Operating Temperature :
- -
- Packaging :
- Bulk
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- Lo-PROfile，513
- Termination :
- Solder
- Type :
- DIP，0.6" (15.24mm) Row Spacing
- 倍数 :
- 1
