Imago est modo reference
HF115AC-0.0055-AC-105
- Description :
- THERM PAD SIP PKG W/ADH HI-FLOW
- Hæc est pars Manufacturer
- Datasheet (1)
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- Adhesive :
- Adhesive - One Side
- Backing，Carrier :
- Fiberglass
- Color :
- Gray
- Material :
- Phase Change Compound
- Outline :
- 36.83mm x 21.29mm
- Series :
- Hi-Flow 115-AC
- Shape :
- Rectangle
- Thermal Conductivity :
- 0.8 W/m-K
- Thermal Resistivity :
- 0.35°C/W
- Thickness :
- 0.0055" (0.140mm)
- Usage :
- SIP
