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S200
- Description :
- POCKET SOLDER LEAD-FREE SAC 305
- Hæc est pars Manufacturer
- Datasheet (1)
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- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- 0.040" (1.02mm)
- Flux Type :
- Rosin Activated (RA)
- Form :
- -
- Melting Point :
- 423 ~ 424°F (217 ~ 218°C)
- Process :
- Lead Free
- Series :
- SMD2
- Shelf Life :
- 5 Years (Date of Manufacture)
- Type :
- Wire Solder
- Wire Gauge :
- 18 AWG，19 SWG
