834000T00000
- Description :
- HEATSINK STAMP 19.4X25.4X11.4MM
- Hæc est pars Manufacturer
- Datasheet (1)
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- Attachment Method :
- SMD Pad
- Diameter :
- -
- Height Off Base (Height of Fin) :
- 0.450" (11.43mm)
- Length :
- 0.763" (19.38mm)
- Material :
- Copper
- Material Finish :
- Tin
- Package Cooled :
- TO-263 (D2Pak)
- Power Dissipation @ Temperature Rise :
- 1.5W @ 20°C
- Series :
- -
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 4.00°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- -
- Type :
- Board Level
- Width :
- 1.000" (25.40mm)
