834100T00000

Description :
HEATSINK STAMP 22.9X8X10.2MM
Attachment Method :
SMD Pad
Diameter :
-
Height Off Base (Height of Fin) :
0.400" (10.16mm)
Length :
0.315" (8.00mm)
Material :
Copper
Material Finish :
Tin
Package Cooled :
TO-252 (DPAK)
Power Dissipation @ Temperature Rise :
2.5W @ 35°C
Series :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
17.50°C/W @ 300 LFM
Thermal Resistance @ Natural :
-
Type :
Top Mount
Width :
0.900" (22.86mm)

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