HSP-1

Description :
THERMAL PAD SINGLE PHASE
Adhesive :
-
Backing,Carrier :
-
Color :
White
Material :
-
Outline :
57.15mm x 44.45mm
Series :
HSP
Shape :
Rectangle
Thermal Conductivity :
1.0 W/m-K
Thermal Resistivity :
-
Thickness :
0.0039" (0.100mm)
Usage :
Single Phase SSRs,M50 Power Modules

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