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APF30-30-10CB/A01
- Description :
- HEATSINK FORGED W/ADHESIVE TAPE
- Hæc est pars Manufacturer
- Datasheet (1)
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- Attachment Method :
- Thermal Tape, Adhesive (Included)
- Diameter :
- -
- Height Off Base (Height of Fin) :
- 0.370" (9.40mm)
- Length :
- 1.181" (30.00mm)
- Material :
- Aluminum
- Material Finish :
- Black Anodized
- Package Cooled :
- Assorted (BGA, LGA, CPU, ASIC...)
- Power Dissipation @ Temperature Rise :
- -
- Series :
- APF
- Shape :
- Square, Fins
- Thermal Resistance @ Forced Air Flow :
- 3.30°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- -
- Type :
- Top Mount
- Width :
- 1.181" (30.00mm)
