D0816-42

Description :
CONN IC DIP SOCKET 16POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
10μin (0.25μm)
Contact Finish Thickness - Post :
196.8μin (5.00μm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polycyclohexylenedimethylene Terephthalate (PCT),Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
16 (2 x 8)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Bulk
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
D0
Termination :
Wire Wrap
Type :
DIP,0.3" (7.62mm) Row Spacing
倍数 :
1

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