Intel

EPF6010AFC256-3

Description :
IC FPGA
package :
256-FBGA (17x17)
Mounting Type :
Surface Mount
Number of Gates :
10000
Number of I/O :
171
Number of LABs/CLBs :
88
Number of Logic Elements/Cells :
880
Operating Temperature :
0°C ~ 85°C (TJ)
Package / Case :
256-BGA
Series :
FLEX 6000
Supplier Device Package :
256-FBGA (17x17)
Total RAM Bits :
-
Voltage - Supply :
3 V ~ 3.6 V

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