M2S050-FGG896I

Description :
IC FPGA SOC 896-FBGA
package :
896-FBGA (31x31)
Architecture :
MCU,FPGA
Connectivity :
CANbus,Ethernet,I2C,SPI,UART/USART,USB
Core Processor :
ARM® Cortex®-M3
Flash Size :
256kB
Operating Temperature :
-40°C ~ 100°C (TJ)
Package / Case :
896-BGA
Packaging :
Tray
Peripherals :
DDR,PCIe,SERDES
Primary Attributes :
FPGA - 50K Logic Modules
RAM Size :
64kB
Series :
SmartFusion2
Speed :
166MHz
Supplier Device Package :
896-FBGA (31x31)

Similia products