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117-43-430-41-005000
- Description :
- CONN IC DIP SOCKET 30POS GOLD
- Hæc est pars Manufacturer
- Datasheet (1)
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- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 30μin (0.76μm)
- Contact Finish Thickness - Post :
- 200μin (5.08μm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass Alloy
- Features :
- Open Frame
- Housing Material :
- Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 30 (2 x 15)
- Operating Temperature :
- -55°C ~ 125°C
- Packaging :
- Tube
- Pitch - Mating :
- 0.070" (1.78mm)
- Pitch - Post :
- 0.070" (1.78mm)
- Series :
- 117
- Termination :
- Solder
- Type :
- DIP，0.4" (10.16mm) Row Spacing
- 倍数 :
- 1
