714-43-210-31-018000

Description :
CONN IC DIP SOCKET 10POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
30μin (0.76μm)
Contact Finish Thickness - Post :
30μin (0.76μm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass Alloy
Features :
Closed Frame
Housing Material :
Polycyclohexylenedimethylene Terephthalate (PCT),Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
10 (2 x 5)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Bulk
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
714
Termination :
Solder
Type :
DIP,0.1" (2.54mm) Row Spacing
倍数 :
1

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