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BU200Z-178-HT
- Description :
- CONN IC DIP SOCKET 20POS GOLD
- Hæc est pars Manufacturer
- Datasheet (1)
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- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Copper
- Contact Finish Thickness - Mating :
- 78.7μin (2.00μm)
- Contact Finish Thickness - Post :
- Flash
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Open Frame
- Housing Material :
- Polybutylene Terephthalate (PBT)，Glass Filled
- Mounting Type :
- Surface Mount
- Number of Positions or Pins (Grid) :
- 20 (2 x 10)
- Operating Temperature :
- -55°C ~ 125°C
- Packaging :
- Tube
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- BU-178HT
- Termination :
- Solder
- Type :
- DIP，0.3" (7.62mm) Row Spacing
- 倍数 :
- 1
