ED16DT

Description :
CONN IC DIP SOCKET 16POS TIN
Contact Finish - Mating :
Tin
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
60μin (1.52μm)
Contact Finish Thickness - Post :
60μin (1.52μm)
Contact Material - Mating :
Phosphor Bronze
Contact Material - Post :
Phosphor Bronze
Features :
Open Frame
Housing Material :
Polybutylene Terephthalate (PBT),Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
16 (2 x 8)
Operating Temperature :
-55°C ~ 110°C
Packaging :
Tube
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
ED
Termination :
Solder
Type :
DIP,0.3" (7.62mm) Row Spacing
倍数 :
1

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