Imago est modo reference
DC0025/01-TI900-0.12
- Description :
- THERMAL PAD TI900 SIP 0.12MM
- Hæc est pars Manufacturer
- Datasheet (1)
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- Adhesive :
- -
- Backing，Carrier :
- Viscose
- Color :
- White
- Material :
- Silicone
- Outline :
- 36.83mm x 21.29mm
- Series :
- Ti900
- Shape :
- Rectangle
- Thermal Conductivity :
- 1.8 W/m-K
- Thermal Resistivity :
- -
- Thickness :
- 0.0050" (0.127mm)
- Usage :
- SIP
