TI900-24-21.01-0.12

Imago est modo reference

TI900-24-21.01-0.12

t-Global Technology

Description :: THERMAL PAD 24X21.01X0.12MM

Hæc est pars Manufacturer
Datasheet (1)
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Adhesive :: -

Backing，Carrier :: Viscose

Color :: White

Material :: Silicone

Outline :: 24.00mm x 21.01mm

Series :: Ti900

Shape :: Rectangle

Thermal Conductivity :: 1.8 W/m-K

Thermal Resistivity :: -

Thickness :: 0.0050" (0.127mm)

Usage :: -

TI900-24-21.01-0.12 Datasheet

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magis products

200 in stock

partus tempus： III dies

MOQ : 1 MPQ : 1

TI900-24-21.01-0.12

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