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508-AG11D-ES
- Description :
- CONN IC DIP SOCKET 8POS GOLD
- Hæc est pars Manufacturer
- Datasheet (0)
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- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin-Lead
- Contact Finish Thickness - Mating :
- 25μin (0.63μm)
- Contact Finish Thickness - Post :
- -
- Contact Material - Mating :
- Copper Alloy
- Contact Material - Post :
- Copper Alloy
- Features :
- Closed Frame
- Housing Material :
- Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 8 (2 x 4)
- Operating Temperature :
- -55°C ~ 105°C
- Packaging :
- Tube
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- 500
- Termination :
- Solder
- Type :
- DIP，0.3" (7.62mm) Row Spacing
- 倍数 :
- 1
