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822-AG11D-ESL-LF
- Description :
- CONN IC DIP SOCKET 22POS GOLD
- Hæc est pars Manufacturer
- Datasheet (0)
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- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- Flash
- Contact Finish Thickness - Post :
- Flash
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Copper
- Features :
- Open Frame
- Housing Material :
- Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 22 (2 x 11)
- Operating Temperature :
- -55°C ~ 105°C
- Packaging :
- Tube
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- 800
- Termination :
- Solder
- Type :
- DIP，0.4" (10.16mm) Row Spacing
- 倍数 :
- 1
