678-39-C

Attachment Method :

Clip, Solder Foot

Diameter :

-

Height Off Base (Height of Fin) :

1.520" (38.61mm)

Length :

2.362" (60.00mm)

Material :

Aluminum

Material Finish :

Black Anodized

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Power Dissipation @ Temperature Rise :

-

Series :

678

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

0.60°C/W @ 600 LFM

Thermal Resistance @ Natural :

-

Type :

Board Level, Vertical

Width :

0.984" (25.00mm)