Xilinx Inc.

XA3S400-4FGG456I

Description :
IC FPGA 264 I/O 456FBGA
package :
456-FBGA (23x23)
Mounting Type :
Surface Mount
Number of Gates :
400000
Number of I/O :
264
Number of LABs/CLBs :
896
Number of Logic Elements/Cells :
8064
Operating Temperature :
-40°C ~ 100°C (TJ)
Package / Case :
456-BBGA
Series :
Automotive,AEC-Q100,Spartan-3 XA
Supplier Device Package :
456-FBGA (23x23)
Total RAM Bits :
294912
Voltage - Supply :
1.14 V ~ 1.26 V

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