Xilinx Inc.

XAZU2EG-L1SFVC784I

Description :
XAZU2EG-L1SFVC784I
package :
784-FCBGA (23x23)
Architecture :
MPU,FPGA
Connectivity :
CANbus,I2C,SPI,UART/USART,USB
Core Processor :
Quad ARM® Cortex®-A9 MPCore® with CoreSight®,Dual ARM® Cortex®-R5 MPCore® with CoreSight®
Flash Size :
-
Operating Temperature :
-40°C ~ 100°C (TJ)
Package / Case :
784-BFBGA,FCBGA
Packaging :
Tray
Peripherals :
DMA,WDT
Primary Attributes :
Zynq®UltraScale+® FPGA,154K+ Logic Cells
RAM Size :
1.2MB
Series :
Zynq UltraScale+ MPSoC EG
Speed :
500MHz,1.2GHz
Supplier Device Package :
784-FCBGA (23x23)

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