Xilinx Inc.

XC7Z030-1FBG676I

Description :
IC SOC CORTEX-A9 KINTEX7 676FBGA
package :
676-FCBGA (27x27)
Architecture :
MCU,FPGA
Connectivity :
CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
Core Processor :
Dual ARM® Cortex®-A9 MPCore® with CoreSight®
Flash Size :
-
Operating Temperature :
-40°C ~ 100°C (TJ)
Package / Case :
676-BBGA,FCBGA
Packaging :
Tray
Peripherals :
DMA
Primary Attributes :
Kintex®-7 FPGA,125K Logic Cells
RAM Size :
256kB
Series :
Zynq-7000
Speed :
667MHz
Supplier Device Package :
676-FCBGA (27x27)

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