Xilinx Inc.

XCV150-6FG456C

Description :
IC FPGA 260 I/O 456FBGA
package :
456-FBGA (23x23)
Mounting Type :
Surface Mount
Number of Gates :
164674
Number of I/O :
260
Number of LABs/CLBs :
864
Number of Logic Elements/Cells :
3888
Operating Temperature :
0°C ~ 85°C (TJ)
Package / Case :
456-BBGA
Series :
Virtex
Supplier Device Package :
456-FBGA (23x23)
Total RAM Bits :
49152
Voltage - Supply :
2.375 V ~ 2.625 V

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