XCZU11EG-2FFVC1156E
- Description :
- IC FPGA 360 I/O 1156FCBGA
- package :
- 1156-FCBGA (35x35)
- Hæc est pars Manufacturer
- Datasheet (1)
- Add to Favorites
- Add to compare
- Architecture :
- MCU，FPGA
- Connectivity :
- CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
- Core Processor :
- Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2
- Flash Size :
- -
- Operating Temperature :
- 0°C ~ 100°C (TJ)
- Package / Case :
- 1156-BBGA，FCBGA
- Packaging :
- Tray
- Peripherals :
- DMA，WDT
- Primary Attributes :
- Zynq®UltraScale+® FPGA，653K+ Logic Cells
- RAM Size :
- 256kB
- Series :
- Zynq UltraScale+ MPSoC EG
- Speed :
- 533MHz，600MHz，1.3GHz
- Supplier Device Package :
- 1156-FCBGA (35x35)
