XCZU17EG-L2FFVD1760E
- Description :
- IC FPGA 308 I/O 1760FCBGA
- package :
- 1760-FCBGA (42.5x42.5)
- Hæc est pars Manufacturer
- Datasheet (1)
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- Architecture :
- MCU，FPGA
- Connectivity :
- CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
- Core Processor :
- Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2
- Flash Size :
- -
- Operating Temperature :
- 0°C ~ 100°C (TJ)
- Package / Case :
- 1760-BBGA，FCBGA
- Packaging :
- Tray
- Peripherals :
- DMA，WDT
- Primary Attributes :
- Zynq®UltraScale+® FPGA，926K+ Logic Cells
- RAM Size :
- 256kB
- Series :
- Zynq UltraScale+ MPSoC EG
- Speed :
- 533MHz，600MHz，1.3GHz
- Supplier Device Package :
- 1760-FCBGA (42.5x42.5)
