XCZU6CG-L1FFVB1156I

Description :
IC FPGA 328 I/O 1156FCBGA
package :
1156-FCBGA (35x35)
Architecture :
MCU,FPGA
Connectivity :
CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
Core Processor :
Dual ARM® Cortex®-A53 MPCore® with CoreSight®,Dual ARM®Cortex®-R5 with CoreSight®
Flash Size :
-
Operating Temperature :
-40°C ~ 100°C (TJ)
Package / Case :
1156-BBGA,FCBGA
Packaging :
Tray
Peripherals :
DMA,WDT
Primary Attributes :
Zynq®UltraScale+® FPGA,469K+ Logic Cells
RAM Size :
256kB
Series :
Zynq UltraScale+ MPSoC CG
Speed :
500MHz,1.2GHz
Supplier Device Package :
1156-FCBGA (35x35)

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