Xilinx Inc.

XCZU9CG-L2FFVC900E

Description :
IC FPGA 204 I/O 900FCBGA
package :
900-FCBGA (31x31)
Architecture :
MCU,FPGA
Connectivity :
CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
Core Processor :
Dual ARM® Cortex®-A53 MPCore® with CoreSight®,Dual ARM®Cortex®-R5 with CoreSight®
Flash Size :
-
Operating Temperature :
0°C ~ 100°C (TJ)
Package / Case :
900-BBGA,FCBGA
Packaging :
Tray
Peripherals :
DMA,WDT
Primary Attributes :
Zynq®UltraScale+® FPGA,599K+ Logic Cells
RAM Size :
256kB
Series :
Zynq UltraScale+ MPSoC CG
Speed :
533MHz,1.3GHz
Supplier Device Package :
900-FCBGA (31x31)

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