- Packaging：
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- Series：
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- Operating Temperature：
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- Mounting Type：
-
- Features：
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- Color：
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- Termination：
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- Contact Finish Thickness：
-
- Contact Material：
-
- Card Type：
-
- Contact Type：
-
- Card Thickness：
-
- Flange Feature：
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- Electus conditionibus;
Odonata Lepidoptera products 140
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Color | Termination | Contact Finish Thickness | Pitch | Contact Material | Card Type | Contact Type | Card Thickness | Flange Feature | Number of Positions/Bay/Row | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Color | Termination | Contact Finish Thickness | Pitch | Contact Material | Card Type | Contact Type | Card Thickness | Flange Feature | Number of Positions/Bay/Row | |
|
TE Connectivity AMP Connectors |
810
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MULTI-BEAM CE 2X4 PWR X 2X4 SIGN
|
Tray | MULTI-BEAM CE | - | Through Hole | - | Black | Press-Fit | 30.0μin (0.76μm) | - | Copper Alloy | Non Specified - Dual Edge | - | 0.062" (1.57mm) | - | - | |||
|
|
TE Connectivity AMP Connectors |
440
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MULTI-BEAM CE 2X13 P + 2X24 S VE
|
Bulk | MULTI-BEAM CE | - | Through Hole | - | Black | Press-Fit | 30.0μin (0.76μm) | - | Copper Alloy | Non Specified - Dual Edge | - | 0.055" (1.40mm) | - | - | |||
|
|
|
Samtec Inc. |
75
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Locking Ramp | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.062" (1.57mm) | - | 37 | ||
|
|
TE Connectivity AMP Connectors |
43
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MULTI-BEAM CE 2X13 P + 2X24 S，S
|
Tray | MULTI-BEAM CE | - | Board Edge，Straddle Mount | - | Black | Solder | 30.0μin (0.76μm) | - | Copper Alloy | - | - | 0.062" (1.57mm) | - | - | |||
|
|
TE Connectivity AMP Connectors |
40
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MULTI-BEAM CE 2X13 P + 2X24 S，R
|
Tray | MULTI-BEAM CE | - | Through Hole，Right Angle | Board Guide | Black | Solder | 30.0μin (0.76μm) | - | Copper Alloy | Non Specified - Dual Edge | - | 0.062" (1.57mm) | - | - | |||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | ||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | |||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | ||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | |||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Latches | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Solder Retention | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | - | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Card Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | ||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | |||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Latches | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | 37 |
