- Packaging:
-
- Operating Temperature:
-
- Mounting Type:
-
- Features:
-
- Color:
-
- Termination:
-
- Contact Finish Thickness:
-
- Contact Material:
-
- Card Type:
-
- Contact Type:
-
- Card Thickness:
-
- Electus conditionibus;
Odonata Lepidoptera products 84
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Color | Termination | Contact Finish Thickness | Pitch | Contact Material | Card Type | Contact Type | Card Thickness | Number of Positions/Bay/Row | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Color | Termination | Contact Finish Thickness | Pitch | Contact Material | Card Type | Contact Type | Card Thickness | Number of Positions/Bay/Row | ||
TE Connectivity AMP Connectors |
810
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MULTI-BEAM CE 2X4 PWR X 2X4 SIGN
|
Tray | MULTI-BEAM CE | - | Through Hole | - | Black | Press-Fit | 30.0μin (0.76μm) | - | Copper Alloy | Non Specified - Dual Edge | - | 0.062" (1.57mm) | - | ||||
TE Connectivity AMP Connectors |
440
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MULTI-BEAM CE 2X13 P + 2X24 S VE
|
Bulk | MULTI-BEAM CE | - | Through Hole | - | Black | Press-Fit | 30.0μin (0.76μm) | - | Copper Alloy | Non Specified - Dual Edge | - | 0.055" (1.40mm) | - | ||||
Samtec Inc. |
75
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide,Locking Ramp | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.062" (1.57mm) | 37 | ||||
TE Connectivity AMP Connectors |
43
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MULTI-BEAM CE 2X13 P + 2X24 S,S
|
Tray | MULTI-BEAM CE | - | Board Edge,Straddle Mount | - | Black | Solder | 30.0μin (0.76μm) | - | Copper Alloy | - | - | 0.062" (1.57mm) | - | ||||
TE Connectivity AMP Connectors |
40
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MULTI-BEAM CE 2X13 P + 2X24 S,R
|
Tray | MULTI-BEAM CE | - | Through Hole,Right Angle | Board Guide | Black | Solder | 30.0μin (0.76μm) | - | Copper Alloy | Non Specified - Dual Edge | - | 0.062" (1.57mm) | - | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide,Latches | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide,Solder Retention | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | - | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide,Card Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 74POS 0.031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide,Latches | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | 37 |