- Series：
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- Operating Temperature：
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- Mounting Type：
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- Features：
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- Termination：
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- Height Above Board：
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- Material Flammability Rating：
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- Contact Finish：
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- Contact Material：
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- Housing Material：
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- Connector/Contact Type：
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- FFC，FCB Thickness：
-
- Locking Feature：
-
- Cable End Type：
-
- Actuator Material：
-
- Electus conditionibus;
Odonata Lepidoptera products 105
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Height Above Board | Material Flammability Rating | Contact Finish | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC，FCB Thickness | Locking Feature | Cable End Type | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Height Above Board | Material Flammability Rating | Contact Finish | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC，FCB Thickness | Locking Feature | Cable End Type | Actuator Material | |
|
|
|
Molex Connector Corporation |
15,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 501912 | -20°C ~ 85°C | Surface Mount，Right Angle | Solder Retention | Solder | - | UL94 V-0 | Gold | 50V | Copper Alloy | Polymer，Glass Filled | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Polymer，Glass Filled | ||
|
|
|
Molex Connector Corporation |
18,333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Bulk | Easy-On 501912 | -20°C ~ 85°C | Surface Mount，Right Angle | Solder Retention | Solder | - | UL94 V-0 | Gold | 50V | Copper Alloy | Polymer，Glass Filled | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Polymer，Glass Filled | ||
|
|
|
Molex Connector Corporation |
18,333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
- | Easy-On 501912 | -20°C ~ 85°C | Surface Mount，Right Angle | Solder Retention | Solder | - | UL94 V-0 | Gold | 50V | Copper Alloy | Polymer，Glass Filled | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Polymer，Glass Filled | ||
|
|
|
Panasonic Electric Works |
500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Cut Strip | Y3B | -55°C ~ 85°C | Surface Mount，Right Angle | - | Solder | 0.035" (0.88mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | FPC | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Tapered | Liquid Crystal Polymer (LCP) | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Tape & Reel (TR) | BackFlip，Easy-On 502598 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention | Solder | 0.045" (1.14mm) | UL94 V-0，UL94 HB | Gold | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Tapered | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
2,771
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Cut Tape (CT) | BackFlip，Easy-On 502598 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention | Solder | 0.045" (1.14mm) | UL94 V-0，UL94 HB | Gold | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Tapered | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
2,771
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
- | BackFlip，Easy-On 502598 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention | Solder | 0.045" (1.14mm) | UL94 V-0，UL94 HB | Gold | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Tapered | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Panasonic Electric Works |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Tape & Reel (TR) | Y3B | -55°C ~ 85°C | Surface Mount，Right Angle | - | Solder | 0.035" (0.88mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | FPC | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Tapered | Liquid Crystal Polymer (LCP) | ||
|
|
|
Panasonic Electric Works |
1,229
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Cut Tape (CT) | Y3B | -55°C ~ 85°C | Surface Mount，Right Angle | - | Solder | 0.035" (0.88mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | FPC | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Tapered | Liquid Crystal Polymer (LCP) | ||
|
|
|
Panasonic Electric Works |
1,229
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
- | Y3B | -55°C ~ 85°C | Surface Mount，Right Angle | - | Solder | 0.035" (0.88mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | FPC | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Tapered | Liquid Crystal Polymer (LCP) | ||
|
|
|
Omron Electronics Inc-EMC Div |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Tape & Reel (TR) | XF2B | -30°C ~ 85°C | Surface Mount，Right Angle | - | Solder | 0.083" (2.10mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Halogen Free | FPC | Contacts，Top and Bottom | 0.20mm | Rotary Lock，Backlock | Straight | Liquid Crystal Polymer (LCP)，Halogen Free | ||
|
|
|
Omron Electronics Inc-EMC Div |
851
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Cut Tape (CT) | XF2B | -30°C ~ 85°C | Surface Mount，Right Angle | - | Solder | 0.083" (2.10mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Halogen Free | FPC | Contacts，Top and Bottom | 0.20mm | Rotary Lock，Backlock | Straight | Liquid Crystal Polymer (LCP)，Halogen Free | ||
|
|
|
Molex Connector Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 503566 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention | Solder | 0.037" (0.95mm) | UL94 V-0，UL94 HB | Gold | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tabbed | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex Connector Corporation |
662
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Cut Tape (CT) | Easy-On 503566 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention | Solder | 0.037" (0.95mm) | UL94 V-0，UL94 HB | Gold | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tabbed | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex Connector Corporation |
662
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
- | Easy-On 503566 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention | Solder | 0.037" (0.95mm) | UL94 V-0，UL94 HB | Gold | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tabbed | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex Connector Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Tape & Reel (TR) | BackFlip，Easy-On 502250 | -25°C ~ 85°C | Surface Mount，Right Angle | - | Solder | 0.035" (0.88mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Notched or Tabbed | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex Connector Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 501628 | -25°C ~ 85°C | Surface Mount，Right Angle | - | Solder | 0.035" (0.88mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tabbed | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Hirose Electric Co Ltd |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Tape & Reel (TR) | FH23 | -55°C ~ 85°C | Surface Mount，Right Angle | Low ion Force (LIF) | Solder | 0.049" (1.25mm) | UL94 V-0 | Tin-Lead | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Liquid Crystal Polymer (LCP) | ||
|
|
|
Hirose Electric Co Ltd |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Cut Tape (CT) | FH23 | -55°C ~ 85°C | Surface Mount，Right Angle | Low ion Force (LIF) | Solder | 0.049" (1.25mm) | UL94 V-0 | Tin-Lead | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Liquid Crystal Polymer (LCP) | ||
|
|
|
Hirose Electric Co Ltd |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Tape & Reel (TR) | FH23 | -55°C ~ 85°C | Surface Mount，Right Angle | Low ion Force (LIF) | Solder | 0.049" (1.25mm) | UL94 V-0 | Tin-Lead | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Liquid Crystal Polymer (LCP) |
