- Series：
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- Operating Temperature：
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- Features：
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- Height Above Board：
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- Material Flammability Rating：
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- Contact Finish：
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- Contact Material：
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- Housing Material：
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- Connector/Contact Type：
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- FFC，FCB Thickness：
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- Locking Feature：
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- Actuator Material：
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Odonata Lepidoptera products 76
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Features | Height Above Board | Material Flammability Rating | Contact Finish | Voltage Rating | Contact Material | Housing Material | Connector/Contact Type | FFC，FCB Thickness | Locking Feature | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Features | Height Above Board | Material Flammability Rating | Contact Finish | Voltage Rating | Contact Material | Housing Material | Connector/Contact Type | FFC，FCB Thickness | Locking Feature | Actuator Material | |
|
|
|
Molex Connector Corporation |
15,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 501912 | -20°C ~ 85°C | Solder Retention | - | UL94 V-0 | Gold | 50V | Copper Alloy | Polymer，Glass Filled | Contacts，Bottom | 0.20mm | Flip Lock | Polymer，Glass Filled | ||
|
|
|
Molex Connector Corporation |
18,333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Bulk | Easy-On 501912 | -20°C ~ 85°C | Solder Retention | - | UL94 V-0 | Gold | 50V | Copper Alloy | Polymer，Glass Filled | Contacts，Bottom | 0.20mm | Flip Lock | Polymer，Glass Filled | ||
|
|
|
Molex Connector Corporation |
18,333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
- | Easy-On 501912 | -20°C ~ 85°C | Solder Retention | - | UL94 V-0 | Gold | 50V | Copper Alloy | Polymer，Glass Filled | Contacts，Bottom | 0.20mm | Flip Lock | Polymer，Glass Filled | ||
|
|
|
Panasonic Electric Works |
500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Cut Strip | Y3B | -55°C ~ 85°C | - | 0.035" (0.88mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Liquid Crystal Polymer (LCP) | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Tape & Reel (TR) | BackFlip，Easy-On 502598 | -40°C ~ 85°C | Solder Retention | 0.045" (1.14mm) | UL94 V-0，UL94 HB | Gold | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
2,771
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Cut Tape (CT) | BackFlip，Easy-On 502598 | -40°C ~ 85°C | Solder Retention | 0.045" (1.14mm) | UL94 V-0，UL94 HB | Gold | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
2,771
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
- | BackFlip，Easy-On 502598 | -40°C ~ 85°C | Solder Retention | 0.045" (1.14mm) | UL94 V-0，UL94 HB | Gold | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Panasonic Electric Works |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Tape & Reel (TR) | Y3B | -55°C ~ 85°C | - | 0.035" (0.88mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Liquid Crystal Polymer (LCP) | ||
|
|
|
Panasonic Electric Works |
1,229
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Cut Tape (CT) | Y3B | -55°C ~ 85°C | - | 0.035" (0.88mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Liquid Crystal Polymer (LCP) | ||
|
|
|
Panasonic Electric Works |
1,229
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
- | Y3B | -55°C ~ 85°C | - | 0.035" (0.88mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Liquid Crystal Polymer (LCP) | ||
|
|
|
Hirose Electric Co Ltd |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Tape & Reel (TR) | FH23 | -55°C ~ 85°C | Low ion Force (LIF) | 0.049" (1.25mm) | UL94 V-0 | Tin-Lead | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Contacts，Bottom | 0.20mm | Flip Lock | Liquid Crystal Polymer (LCP) | ||
|
|
|
Hirose Electric Co Ltd |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Cut Tape (CT) | FH23 | -55°C ~ 85°C | Low ion Force (LIF) | 0.049" (1.25mm) | UL94 V-0 | Tin-Lead | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Contacts，Bottom | 0.20mm | Flip Lock | Liquid Crystal Polymer (LCP) | ||
|
|
|
Hirose Electric Co Ltd |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Tape & Reel (TR) | FH23 | -55°C ~ 85°C | Low ion Force (LIF) | 0.049" (1.25mm) | UL94 V-0 | Tin-Lead | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Contacts，Bottom | 0.20mm | Flip Lock | Liquid Crystal Polymer (LCP) | ||
|
|
|
Hirose Electric Co Ltd |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Cut Tape (CT) | FH23 | -55°C ~ 85°C | Low ion Force (LIF) | 0.049" (1.25mm) | UL94 V-0 | Tin-Lead | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Contacts，Bottom | 0.20mm | Flip Lock | Liquid Crystal Polymer (LCP) | ||
|
|
|
Molex Connector Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | Tin Bismuth | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Contacts，Bottom | 0.20mm | Flip Lock | Polyamide (PA46)，Nylon 4/6 | ||
|
|
|
Molex Connector Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Bulk | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | Tin Bismuth | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Contacts，Bottom | 0.20mm | Flip Lock | Polyamide (PA46)，Nylon 4/6 | ||
|
|
|
JAE Electronics |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Bulk | FB6 | -40°C ~ 85°C | Low ion Force (LIF) | 0.047" (1.20mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | Contacts，Bottom | 0.15mm | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
JAE Electronics |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 33POS 0.30MM R/A
|
Bulk | FB8 | -40°C ~ 85°C | Zero ion Force (ZIF) | 0.047" (1.20mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | Contacts，Top | 0.20mm | Rotary Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex Connector Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Bulk | Easy-On 500797 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.041" (1.05mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | Contacts，Bottom | 0.20mm | Flip Lock | Polyamide (PA46)，Nylon 4/6 | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 54393 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.077" (1.95mm) | UL94 V-0 | Gold | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Contacts，Bottom | 0.20mm | Flip Lock | Polyphenylene Sulfide (PPS) |
