- Length：
-
- Width：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 10
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
5,976
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-126 VERT MNT SLIP-ON
|
Board Level, Vertical | 0.520" (13.21mm) | 0.780" (19.81mm) | TO-126 | 0.320" (8.13mm) | 1.0W @ 30°C | 12.00°C/W @ 300 LFM | 26.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,831
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 14-16 DIP BLK ANODIZED
|
Top Mount | 0.890" (22.61mm) | 0.600" (15.24mm) | 14-DIP and 16-DIP | 0.410" (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
10,857
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SLIDE-ON 8-DIP
|
Top Mount | 0.562" (14.27mm) | 0.600" (15.24mm) | 8-DIP | 0.450" (11.43mm) | 1.0W @ 30°C | 8.00°C/W @ 500 LFM | 30.00°C/W | ||
|
|
|
ASSMANN WSW Components |
8,163
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-126 13.20X19.68MM
|
Board Level, Vertical | 0.520" (13.21mm) | 0.775" (19.68mm) | TO-126 | 0.320" (8.13mm) | - | - | 26.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Top Mount | 0.890" (22.61mm) | 0.600" (15.24mm) | 14-DIP and 16-DIP | 0.410" (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 24-DIP BLK ANODIZED
|
Top Mount | 1.460" (37.08mm) | 1.008" (25.60mm) | 24-DIP | 0.580" (14.73mm) | 1.0W @ 20°C | 6.00°C/W @ 400 LFM | 20.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 20-DIP BLK ANODIZED
|
Top Mount | 1.055" (26.80mm) | 0.700" (17.78mm) | 20-DIP | 0.556" (14.12mm) | 2.0W @ 60°C | 20.00°C/W @ 200 LFM | 39.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 18-DIP BLK ANODIZED
|
Top Mount | 1.125" (28.58mm) | 0.700" (17.78mm) | 18-DIP | 0.556" (14.12mm) | 2.0W @ 60°C | 20.00°C/W @ 200 LFM | 39.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Top Mount | 0.562" (14.27mm) | 0.600" (15.24mm) | 8-DIP | 0.450" (11.43mm) | 1.0W @ 30°C | 8.00°C/W @ 500 LFM | 30.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Top Mount | 2.125" (53.97mm) | 1.065" (27.05mm) | 40-DIP | 0.485" (12.32mm) | 1.0W @ 20°C | 7.00°C/W @ 300 LFM | 24.00°C/W |
