- Series：
-
- Length：
-
- Width：
-
- Diameter：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 11,371
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
24,011
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK TO-220 .375" COMPACT
|
- | Board Level | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | 0.375" (9.52mm) | 3.0W @ 80°C | 12.00°C/W @ 200 LFM | 25.90°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
17,317
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK TO-220 .500" COMPACT
|
- | Board Level | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | 0.500" (12.70mm) | 1.5W @ 40°C | 10.00°C/W @ 200 LFM | 24.40°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
6,712
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Aluminum | 0.334" (8.50mm) | 0.250" (6.35mm) | - | Press Fit | 6-Dip and 8-Dip | 0.189" (4.80mm) | - | - | 80.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
14,552
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 PWR CLR 1.45"10W
|
- | Board Level | Aluminum | 1.450" (36.83mm) | 0.780" (19.81mm) | - | Bolt On | TO-220 (Dual) | 0.850" (21.60mm) | 4.0W @ 40°C | 5.00°C/W @ 200 LFM | 6.40°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
42,175
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK VERT PLUG-IN TO-220
|
- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.500" (12.70mm) | - | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
18,400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
- | Top Mount | Copper | 0.320" (8.13mm) | 0.790" (20.07mm) | - | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
|
|
|
ASSMANN WSW Components |
18,715
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
- | Top Mount | Copper | 0.320" (8.13mm) | 0.790" (20.07mm) | - | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
|
|
|
ASSMANN WSW Components |
18,715
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
- | Top Mount | Copper | 0.320" (8.13mm) | 0.790" (20.07mm) | - | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,250
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
18,047
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 14-16 DIP BLACK .19"
|
- | Top Mount | Aluminum | 0.250" (6.35mm) | 0.731" (18.57mm) | - | Thermal Tape, Adhesive (Not Included) | 14-DIP and 16-DIP | 0.190" (4.83mm) | 0.4W @ 30°C | 50.00°C/W @ 200 LFM | 68.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
16,283
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D2PAK
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
13,880
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 5W BLK
|
- | Board Level | Aluminum | 0.750" (19.05mm) | 0.500" (12.70mm) | - | Clip | TO-220, TO-262 | 0.500" (12.70mm) | 1.5W @ 40°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
10,440
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TWISTED FIN TO-220
|
- | Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 0.942" (23.93mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 13.40°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
9,699
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D-PAK
|
- | Top Mount | Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,750
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
- | Top Mount | Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,764
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
- | Top Mount | Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
16,627
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .5" TO-220
|
- | Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Clip and Board Locks | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | 13.40°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,015
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS 1.5"TALL
|
- | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | 11.00°C/W | Black Anodized |
