- Length：
-
- Width：
-
- Diameter：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Electus conditionibus;
Odonata Lepidoptera products 26
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Length | Width | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Length | Width | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
ASSMANN WSW Components |
6,712
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | 0.334" (8.50mm) | 0.250" (6.35mm) | - | 6-Dip and 8-Dip | 0.189" (4.80mm) | - | - | 80.00°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
338
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK EXTRUSION IGBT/SSR BLK
|
392 | Top Mount | 7.087" (180.01mm) | 4.921" (124.99mm) | - | Power Modules | 5.346" (135.79mm) | - | 0.10°C/W @ 100 LFM | 0.43°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
2,812
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 15X12.8MM
|
- | Board Level | 0.591" (15.01mm) | 0.504" (12.80mm) | - | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 14.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
9,919
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19X12.80MM
|
- | Board Level | 0.748" (19.00mm) | 0.504" (12.80mm) | - | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 14.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
1,389
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK BLK ANOD ALUM TO-220
|
- | Board Level | 1.500" (38.10mm) | 0.504" (12.80mm) | - | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | - | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
1,169
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | 0.748" (19.00mm) | 0.250" (6.35mm) | - | 14-DIP and 16-DIP | 0.189" (4.80mm) | - | - | 46.00°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
2,946
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | 0.900" (23.00mm) | 0.250" (6.35mm) | - | 18-DIP | 0.189" (4.80mm) | - | - | 40.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7,556
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-92 .72" BLK
|
- | Board Level, Vertical | 0.602" (15.29mm) | - | - | TO-92 | 0.720" (18.29mm) | 0.3W @ 20°C | 17.50°C/W @ 400 LFM | 60.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7,490
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 .75" BLACK
|
- | Top Mount | 0.750" (19.05mm) | 0.830" (21.08mm) | 0.316" (8.03mm) ID | TO-5 | 0.395" (10.03mm) | 1.0W @ 30°C | 20.00°C/W @ 300 LFM | 35.00°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
173
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK POWER NO MNT HOLES BLK
|
401 | Board Level | 1.500" (38.10mm) | 4.750" (120.65mm) | - | TO-3, Stud Mount | 1.250" (31.75mm) | 30.0W @ 80°C | 1.50°C/W @ 250 LFM | 3.00°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
255
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK POWER NO MNT HOLES BLK
|
421 | Board Level | 3.000" (76.20mm) | 4.750" (120.65mm) | - | TO-3, DO-5, Stud Mount | 2.625" (66.67mm) | 50.0W @ 58°C | 0.70°C/W @ 250 LFM | 1.16°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
204
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK POWER NO MNT HOLES BLK
|
423 | Board Level | 5.421" (139.70mm) | 4.750" (120.65mm) | - | TO-3, DO-5, Stud Mount | 2.625" (66.67mm) | 50.0W @ 47°C | 0.50°C/W @ 250 LFM | 0.96°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
61
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HI-POWER HEATSINK SSR/IGBT/POWER
|
392 | Top Mount | 4.724" (120.00mm) | 4.921" (124.99mm) | - | Power Modules | 5.346" (135.79mm) | - | 0.20°C/W @ 100 LFM | 0.50°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
23
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HI-POWER HEATSINK SSR/IGBT/POWER
|
392 | Top Mount | 11.800" (299.72mm) | 4.921" (124.99mm) | - | Power Modules | 5.346" (135.79mm) | - | 0.10°C/W @ 100 LFM | 0.33°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
793
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | 0.250" (6.35mm) | 0.748" (19.00mm) | - | 14-DIP and 16-DIP | 0.190" (4.83mm) | - | - | 48.00°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
317
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | 1.299" (32.99mm) | 0.748" (19.00mm) | - | 24-DIP | 0.189" (4.80mm) | - | - | 48.00°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
75
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK C2026 REV A
|
465 | Board Level | 5.000" (127.00mm) | 4.000" (101.60mm) | - | Stud Mounted Diode | 4.000" (101.60mm) | 50.0W @ 38°C | 0.30°C/W @ 500 LFM | 0.76°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Top Mount | 0.602" (15.29mm) | - | - | TO-92 | 1.220" (31.00mm) | 0.5W @ 20°C | 20.00°C/W @ 200 LFM | 40.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Top Mount | 0.406" (10.31mm) | 0.830" (21.08mm) | 0.316" (8.03mm) ID | TO-5 | 0.395" (10.03mm) | 1.0W @ 40°C | 35.00°C/W @ 200 LFM | 40.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 .5" BLACK
|
- | Top Mount | 0.500" (12.70mm) | 0.830" (21.08mm) | 0.316" (8.03mm) ID | TO-5 | 0.395" (10.03mm) | 1.4W @ 50°C | 30.00°C/W @ 200 LFM | 38.00°C/W | Black Anodized |
