- Material:
-
- Length:
-
- Width:
-
- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
- Electus conditionibus;
Odonata Lepidoptera products 87
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
ASSMANN WSW Components |
1,970
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ANOD ALUM TO-220
|
- | Board Level, Vertical | Aluminum | 0.591" (15.01mm) | 0.504" (12.80mm) | TO-220 | 0.500" (12.70mm) | - | - | 26.00°C/W | Black Anodized | ||||
ASSMANN WSW Components |
2,400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ANOD ALUM TO-220
|
- | Board Level | Aluminum | 0.591" (15.01mm) | 0.425" (10.80mm) | TO-220 | 0.500" (12.70mm) | - | - | 26.00°C/W | Black Anodized | ||||
ASSMANN WSW Components |
1,201
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ANOD ALUM TO-220
|
- | Board Level | Aluminum | 0.748" (19.00mm) | 0.504" (12.80mm) | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 6.00°C/W @ 600 LFM | 21.00°C/W | Black Anodized | ||||
ASSMANN WSW Components |
1,630
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM WITH PIN TO-220
|
- | Board Level | Aluminum | 1.500" (38.10mm) | 0.504" (12.80mm) | TO-220 | 0.500" (12.70mm) | - | - | 16.00°C/W | Black Anodized | ||||
ASSMANN WSW Components |
1,136
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 1.374" (34.90mm) | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | 11.00°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
5,824
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | 1.000" (25.40mm) | 1.375" (34.93mm) | TO-220 | 0.500" (12.70mm) | 3.0W @ 50°C | 4.00°C/W @ 700 LFM | 13.00°C/W | Black Anodized | ||||
CUI Inc. |
5,156
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
|
- | Board Level, Vertical | Aluminum | 0.500" (12.70mm) | 0.510" (13.00mm) | TO-220 | 0.748" (19.00mm) | 2.9W @ 75°C | 5.72°C/W @ 200 LFM | 25.86°C/W | Black Anodized | ||||
CUI Inc. |
1,467
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | 0.984" (25.00mm) | 1.359" (34.50mm) | TO-220 | 0.492" (12.50mm) | 5.5W @ 75°C | 4.44°C/W @ 200 LFM | 13.64°C/W | Black Anodized | ||||
CUI Inc. |
1,469
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.378" (35.00mm) | TO-220 | 0.500" (12.70mm) | 5.5W @ 75°C | 4.39°C/W @ 200 LFM | 13.64°C/W | Black Anodized | ||||
CUI Inc. |
1,383
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.378" (35.00mm) | TO-220 | 0.500" (12.70mm) | 5.2W @ 75°C | 4.42°C/W @ 200 LFM | 14.42°C/W | Black Anodized | ||||
CUI Inc. |
1,016
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220,25.
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.375" (34.93mm) | TO-220 | 0.500" (12.70mm) | 5.8W @ 75°C | 3.28°C/W @ 200 LFM | 12.93°C/W | Black Anodized | ||||
CUI Inc. |
1,123
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.772" (45.00mm) | TO-220 | 0.500" (12.70mm) | 6.4W @ 75°C | 3.86°C/W @ 200 LFM | 11.72°C/W | Black Anodized | ||||
CUI Inc. |
1,061
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 50
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.969" (50.00mm) | 1.181" (30.00mm) | TO-220 | 0.472" (12.00mm) | 7.7W @ 75°C | 4.05°C/W @ 200 LFM | 9.74°C/W | Black Anodized | ||||
CUI Inc. |
1,195
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.378" (35.00mm) | TO-220 | 0.500" (12.70mm) | 5.5W @ 75°C | 8.36°C/W @ 200 LFM | 13.64°C/W | Black Anodized | ||||
ASSMANN WSW Components |
294
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | 1.000" (25.40mm) | 1.374" (34.90mm) | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | 14.00°C/W | Black Anodized | ||||
ASSMANN WSW Components |
548
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | 2.000" (50.80mm) | 1.374" (34.90mm) | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | 9.00°C/W | Black Anodized | ||||
ASSMANN WSW Components |
473
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | 2.500" (63.50mm) | 1.374" (34.90mm) | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | 7.00°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
983
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 ALUMINUM
|
- | Board Level, Vertical | Aluminum | 0.748" (19.00mm) | 0.866" (22.00mm) | TO-220 | 0.433" (11.00mm) | - | 11.20°C/W @ 200 LFM | 23.70°C/W | Black Anodized | ||||
CUI Inc. |
943
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.7W ALUMINUM
|
- | Board Level, Vertical | Aluminum | 0.520" (13.21mm) | 0.375" (9.53mm) | TO-220 | 0.748" (19.00mm) | 2.7W @ 75°C | 9.51°C/W @ 200 LFM | 27.78°C/W | Black Anodized | ||||
CUI Inc. |
994
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
|
- | Board Level | Aluminum | 0.748" (19.00mm) | 0.504" (12.80mm) | TO-220 | 0.500" (12.70mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | Black Anodized |