- Material：
-
- Width：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Electus conditionibus;
Odonata Lepidoptera products 41
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,250
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
16,283
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D2PAK
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Top Mount | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,648
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Top Mount | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,648
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Top Mount | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,216
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .45" D2PAK
|
- | Top Mount | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
|
Ohmite |
9,471
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263 BLACK
|
D | Top Mount | Aluminum | 0.500" (12.70mm) | 1.020" (25.91mm) | Solderable Feet | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
1,010
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.031" (26.20mm) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
|
|
|
Ohmite |
3,336
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | Top Mount | Aluminum | 0.500" (12.70mm) | 1.020" (25.91mm) | Solderable Feet | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
|
|
Advanced Thermal Solutions Inc. |
2,297
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.031" (26.20mm) | - | 0.402" (10.21mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
|
|
|
ASSMANN WSW Components |
3,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.031" (26.20mm) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
|
|
|
ASSMANN WSW Components |
3,836
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.031" (26.20mm) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
|
|
|
ASSMANN WSW Components |
3,836
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.031" (26.20mm) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
|
|
|
Ohmite |
1,400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | Top Mount | Aluminum | 0.500" (12.70mm) | 1.020" (25.91mm) | Solderable Feet | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
|
|
|
Ohmite |
1,511
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | Top Mount | Aluminum | 0.500" (12.70mm) | 1.020" (25.91mm) | Solderable Feet | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
|
|
|
Ohmite |
1,511
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | Top Mount | Aluminum | 0.500" (12.70mm) | 1.020" (25.91mm) | Solderable Feet | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
|
|
Advanced Thermal Solutions Inc. |
2,750
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.031" (26.20mm) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
|
|
Advanced Thermal Solutions Inc. |
2,833
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.031" (26.20mm) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin |
