- Material：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Electus conditionibus;
Odonata Lepidoptera products 5
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Wakefield-Vette |
543
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER TO-220 TO-247
|
- | Board Level, Vertical | Ceramic | 0.803" (20.40mm) | 1.339" (34.00mm) | Solderable Feet | 1.512" (38.40mm) | - | 3.80°C/W @ 200 LFM | 7.00°C/W | - | ||
|
|
|
Ohmite |
44
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK HORIZONTAL
|
VM | Board Level | Aluminum | 1.520" (38.61mm) | 2.362" (60.00mm) | Solderable Feet | 0.984" (25.00mm) | 10.0W @ 50°C | 0.60°C/W @ 600 LFM | - | Black Anodized | ||
|
|
|
Ohmite |
29
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK UNIVERSAL
|
VM | Board Level | Aluminum | 1.520" (38.61mm) | 2.362" (60.00mm) | Solderable Feet | 0.984" (25.00mm) | 10.0W @ 50°C | 0.60°C/W @ 600 LFM | - | Black Anodized | ||
|
|
|
Ohmite |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERTICAL
|
VM | Board Level, Vertical | Aluminum | 1.520" (38.61mm) | 2.362" (60.00mm) | Solderable Feet | 0.984" (25.00mm) | 10.0W @ 50°C | 0.60°C/W @ 600 LFM | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | 1.840" (46.74mm) | 0.490" (12.44mm) | Bolt On and PC Pin | 1.750" (44.45mm) | 4.0W @ 30°C | 1.00°C/W @ 700 LFM | 6.30°C/W | Black Anodized |
