- Material：
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- Length：
-
- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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Odonata Lepidoptera products 36
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Ohmite |
2,569
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220 1.0"
|
F | Board Level, Vertical | Aluminum | 1.000" (25.40mm) | 1.638" (41.60mm) | Bolt On and PC Pin | TO-220 | 4.0W @ 30°C | 3.00°C/W @ 400 LFM | 4.70°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
1,377
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | 1.000" (25.40mm) | 1.638" (41.60mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | - | - | 6.50°C/W | Black Anodized | ||
|
|
|
Ohmite |
1,640
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220 1.5"
|
F | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 1.638" (41.60mm) | Bolt On and PC Pin | TO-220 | 10.0W @ 50°C | 1.50°C/W @ 600 LFM | 3.80°C/W | Black Anodized | ||
|
|
|
Ohmite |
493
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220 2.0"
|
F | Board Level, Vertical | Aluminum | 2.000" (50.80mm) | 1.638" (41.60mm) | Bolt On and PC Pin | TO-220 | 4.0W @ 20°C | 2.00°C/W @ 300 LFM | 3.40°C/W | Black Anodized | ||
|
|
|
Ohmite |
3,241
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220 2.5"
|
F | Board Level, Vertical | Aluminum | 2.500" (63.50mm) | 1.638" (41.60mm) | Bolt On and PC Pin | TO-220 | 10.0W @ 50°C | 2.00°C/W @ 300 LFM | 3.00°C/W | Black Anodized | ||
|
|
|
Advanced Thermal Solutions Inc. |
81
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X35X25MM
|
- | Top Mount | Aluminum | 11.800" (299.72mm) | 2.010" (51.00mm) | Adhesive | - | - | 3.00°C/W @ 200 LFM | 9.60°C/W | Degreased | ||
|
|
|
ASSMANN WSW Components |
774
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | 2.000" (50.80mm) | 1.638" (41.60mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | - | - | 4.00°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
450
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | 2.500" (63.50mm) | 1.638" (41.60mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | - | - | 3.50°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
96
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Aluminum | 0.591" (15.01mm) | 2.756" (70.00mm) | Bolt On | TO-220, TOP-3 | - | - | 5.00°C/W | Black Anodized | ||
|
|
|
Ohmite |
44
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK HORIZONTAL
|
VM | Board Level | Aluminum | 1.520" (38.61mm) | 2.362" (60.00mm) | Solderable Feet | TO-220, TO-247 | 10.0W @ 50°C | 0.60°C/W @ 600 LFM | - | Black Anodized | ||
|
|
|
Ohmite |
29
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK UNIVERSAL
|
VM | Board Level | Aluminum | 1.520" (38.61mm) | 2.362" (60.00mm) | Solderable Feet | TO-220, TO-247 | 10.0W @ 50°C | 0.60°C/W @ 600 LFM | - | Black Anodized | ||
|
|
|
Advanced Thermal Solutions Inc. |
32
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X13.9X25MM
|
- | Top Mount | Aluminum | 11.800" (299.72mm) | 0.547" (13.89mm) | Adhesive | - | - | 11.50°C/W @ 200 LFM | 21.00°C/W | Degreased | ||
|
|
|
CUI Inc. |
746
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-218, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.638" (41.60mm) | PC Pin | TO-218 | 8.1W @ 75°C | 3.09°C/W @ 200 LFM | 9.26°C/W | Black Anodized | ||
|
|
|
CUI Inc. |
748
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-218, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.638" (41.60mm) | PC Pin | TO-218 | 10.0W @ 75°C | 4.03°C/W @ 200 LFM | 7.50°C/W | Black Anodized | ||
|
|
|
CUI Inc. |
592
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION,TO-218, 25.
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.654" (42.00mm) | PC Pin | TO-218 | 8.2W @ 75°C | 2.29°C/W @ 200 LFM | 9.15°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 1.638" (41.60mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | - | - | 5.00°C/W | Black Anodized | ||
|
|
|
Ohmite |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERTICAL
|
VM | Board Level, Vertical | Aluminum | 1.520" (38.61mm) | 2.362" (60.00mm) | Solderable Feet | TO-220, TO-247 | 10.0W @ 50°C | 0.60°C/W @ 600 LFM | - | Black Anodized | ||
|
|
|
Advanced Thermal Solutions Inc. |
17
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X25X25MM
|
- | Top Mount | Aluminum | 11.800" (299.72mm) | 0.984" (25.00mm) | Adhesive | - | - | 4.50°C/W @ 200 LFM | 11.70°C/W | Degreased | ||
|
|
|
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-218, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.638" (41.60mm) | PC Pin | TO-218 | 8.1W @ 75°C | 3.09°C/W @ 200 LFM | 9.26°C/W | Black Anodized | ||
|
|
|
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-218, 31
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.250" (31.75mm) | 1.638" (41.60mm) | PC Pin | TO-218 | 9.8W @ 75°C | 3.63°C/W @ 200 LFM | 7.65°C/W | Black Anodized |
