- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Thermal Resistance @ Forced Air Flow:
-
Odonata Lepidoptera products 2
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | ||
CUI Inc. |
Quaestiones
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- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-252, 8 X
|
0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPAK) | 0.400" (10.16mm) | 10.05°C/W @ 200 LFM | ||||
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 14.
|
0.590" (14.99mm) | 1.020" (25.91mm) | TO-263 (D2Pak) | 0.375" (9.52mm) | 8.15°C/W @ 200 LFM |