- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
Odonata Lepidoptera products 2
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Bolt On | TO-218 | 2.50°C/W @ 200 LFM | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Bolt On and PC Pin | TO-220 | 2.00°C/W @ 300 LFM |
