- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
Odonata Lepidoptera products 3
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,336
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN/CLIP
|
Clip and PC Pin | TO-220 | 8.0W @ 40°C | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,040
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 10W H=1.5" BLK
|
Bolt On | TO-220 | 8.0W @ 40°C | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,120
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-218 W/PINS 1.5"TALL
|
Bolt On and PC Pin | TO-218 | 10.0W @ 50°C | 5.00°C/W |
