- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
Odonata Lepidoptera products 9
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
8,455
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB .25
|
- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On and PC Pin | TO-220 | 0.250" (6.35mm) | 1.5W @ 50°C | 32.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
15,923
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT/HORZ MOUNT
|
- | Board Level | Aluminum | 0.600" (15.24mm) | 0.500" (12.70mm) | Clip | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 40°C | 26.80°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
9,752
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON/TAB
|
- | Board Level, Vertical | Aluminum | 0.600" (15.24mm) | 0.500" (12.70mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 40°C | 26.80°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,574
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON BLACK
|
- | Board Level, Vertical | Aluminum | 0.600" (15.24mm) | 0.500" (12.70mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 40°C | 26.80°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
927
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DPAK SMT TIN PLATED
|
217 | Top Mount | Copper | 0.740" (18.80mm) | 0.600" (15.24mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 0.360" (9.14mm) | 1.0W @ 55°C | 55.00°C/W | Tin | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINKS
|
217 | Top Mount | Copper | 0.740" (18.80mm) | 0.600" (15.24mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 0.360" (9.14mm) | 1.0W @ 55°C | 55.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Aluminum | 0.600" (15.24mm) | 0.500" (12.70mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 40°C | 26.80°C/W | Black Anodized | ||
|
|
|
Comair Rotron |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.7X12.7MM
|
- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.500" (12.70mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 40°C | - | Black Anodized | ||
|
|
|
Comair Rotron |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 6.4X13.3X19.1MM
|
- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On and PC Pin | TO-220 | 0.250" (6.35mm) | 1.5W @ 50°C | - | Black Anodized |
