- Material：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
Odonata Lepidoptera products 7
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,152
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT MNT 1.18"
|
- | Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | 1.0W @ 20°C | 13.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,014
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON/TAB
|
- | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 0.500" (12.70mm) | Clip and PC Pin | 3.0W @ 60°C | 18.80°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK CLIP-ON
|
- | Board Level | Aluminum | 1.500" (38.10mm) | 0.500" (12.70mm) | Clip | 3.0W @ 60°C | 18.80°C/W | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
2,948
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIPON W/TAB
|
- | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 0.500" (12.70mm) | Clip and PC Pin | - | 20.00°C/W | Black Anodized | |||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERT ALUM BLACK TO-220
|
265 | Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | 4.0W @ 56°C | 14.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 0.500" (12.70mm) | Clip and PC Pin | 3.0W @ 60°C | 18.80°C/W | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 COPPER W/TAB
|
- | Board Level, Vertical | Copper | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and Board Mounts | - | 13.00°C/W | Tin |
