- Material：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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Odonata Lepidoptera products 2
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
|
|
CUI Inc. |
1,434
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 6.5W ALUMINUM
|
- | Board Level | Aluminum | 1.450" (36.83mm) | 1.750" (44.45mm) | Bolt On | 0.370" (9.40mm) | 6.5W @ 75°C | 11.54°C/W | ||
|
|
|
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 63
|
HSE | Board Level, Vertical | Aluminum Alloy | 2.480" (63.00mm) | 1.378" (35.00mm) | PC Pin | 0.492" (12.50mm) | 9.6W @ 75°C | 7.81°C/W |
